Loyola University Chicago School of law is hosting the 2018 Patent Law Interview Program on Thursday, July 26 and Friday, July 27 in Chicago, Illinois. The 2018 Patent Law Interview Program will be accepting registrations from:
- JD students graduating in May/June 2019 (3Ls)
- JD students graduating in May/June 2020 (2Ls)
- JD students graduating in December 2018/January 2019 (3Ls)
- JD students graduating in December 2019/January 2020 (2Ls)
- Students in Intellectual Property LLM programs with anticipated graduation dates in 2019 and 2020
Each year roughly 1,500 law students register for the program, submit their resumes and transcripts, and bid on interviews with the nation-wide employers that interest them. The program is entirely employer selected – which means that participating employers review the materials submitted to them and choose the law students they are interested in interviewing at the program. Roughly half of the students registered for the program are selected for interviews each year.
Students with undergraduate or graduate degrees in engineering or a technical science should consider registering for the program. You do not need to be patent bar eligible to register, although the vast majority of employers participating in the program are seeking patent bar eligible students.
For more information on the program, please refer to the Loyola Patent Program website at: http://www.luc.edu/law/career/patent_students.html.
There is a non-refundable $35 registration fee for which you will not need to pay; NYU will be covering all registration fees for students.
IMPORTANT PATENT LAW DATES
March 1: Student Registration Begins
March 23 at 11:59 p.m. CST: Deadline for Student Registration
May 14: Students Receive Access to PIPER
May 29: Student Bidding Begins
June 12: Student Bidding Deadline
July 11: Preliminary Interview Schedules Available on CSM
July 11-12: Interview Cancellation Period
July 16: Final Interview Schedules Available
July 26-27: 2018 Patent Law Interview Program
Please direct any questions about the program to the Patent Program Liaison in our office, Dayana Soler at firstname.lastname@example.org